Search filters

List of works by Winco Kam Chuen Yung

355nm Nd:YAG laser ablation of polyimide and its thermal effect

A Review of Prognostic Techniques for High-Power White LEDs

article

A Temperature Model For Ultrasonic Measurement of Titanium Welds

scholarly article published January 1995

A life-cycle assessment for eco-redesign of a consumer electronic product

A stepped composite methodology to redesign manufacturing processes through re‐engineering and benchmarking

A study of the heat-affected zone in the UV YAG laser drilling of GFRP materials

Additive Manufacturing of Cobalt-Based Organic Ferromagnetic Materials

scholarly article by Junfeng Huang et al published 2017 in IEEE Magnetics Letters

Additive and Photochemical Manufacturing of Copper.

scientific article

An environmental assessment framework with respect to the Requirements of Energy-using Products Directive

An integrated model for manufacturing process improvement

article

An investigation into welding parameters affecting the tensile properties of titanium welds

scholarly article by Winco K.C. Yung et al published January 1997 in Journal of Materials Processing Technology

Anomaly detection for chromaticity shift of high power white LED with mahalanobis distance approach

Application of value delivery system (VDS) and performance benchmarking in flexible business process reengineering

Chemorheological study of phosphorylated flame retardant epoxies

Comparison of statistical models for the lumen lifetime distribution of high power white LEDs

Copper Direct Drilling With TEA $hbox CO_2$ Laser in Manufacture of High-Density Interconnection Printed Circuit Board

article by X.Y. Fang & K.C. Yung published July 2006 in IEEE Transactions on Electronics Packaging Manufacturing

Correlating Interconnect Stress Test and Accelerated Thermal Cycling for Accessing the Reliabilities of High Performance Printed Circuit Boards

Corrosion resistance enhancement of Ni-resist ductile iron by laser surface alloying

Degradation mechanism beyond device self-heating in high power light-emitting diodes

Eco-redesign of a personal electronic product subject to the energy-using product directive

article by Winco Kam Chuen Yung et al published March 2012 in International Journal of Production Research

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

article

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

article

Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

article

Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

article

Enhanced redshift of the optical band gap in Sn-doped ZnO free standing films using the sol–gel method

Environmental impact of two electrical products with reference to the energy-using products directive

Experimental investigation of 355nm Nd:YAG laser ablation of RCCR in PCB

FINANCE-DRIVEN MAINTENANCE SYSTEM WITH FAILURE MODE CONSIDERATION

Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process

Fabrication of epoxy-montmorillonite hybrid composites used for printed circuit boards via in-situ polymerization

journal article; published in Advanced Composite Materials in 2006

Failure modes, mechanisms, and effects analysis for LED backlight systems used in LCD TVs

Ferroelectric Fatigue versus Electronic Structure of Lead Titanium Perovskite System

article

Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler

scientific article published in December 2013

High repetition rate effect on the chemical characteristics and composition of Upilex-S polyimide ablated by a UV Nd:YAG laser

article

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

scholarly article by Tama Fouzder et al published February 2011 in Journal of Alloys and Compounds

Ink-jet printed high conductive silver traces on polymer substrates sintered at room temperature by a camera flash lamp

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Introduction to graphene electronics – a new era of digital transistors and devices

article

Investigation of corrosion behavior of high nickel ductile iron by laser surface alloying with copper

scholarly article by Dawen Zeng et al published June 2001 in Scripta Materialia

Investigation of laser surface alloying of copper on high nickel austenitic ductile iron

scholarly article by D.W. Zeng et al published August 2002 in Materials Science and Engineering A: Structural Materials: Properties, Microstructures and Processing

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

article

Laser ablation of Upilex-S polyimide: influence of laser wavelength on chemical structure and composition in both ablated area and halo

article

Laser direct patterning of a reduced-graphene oxide transparent circuit on a graphene oxide thin film

Laser polishing of additive manufactured CoCr alloy components with complex surface geometry

Lifetime Estimation of High-Power White LED Using Degradation-Data-Driven Method

article by Jiajie Fan et al published June 2012 in IEEE Transactions on Device and Materials Reliability

Mesostructured composite coating on SAE 1045 carbon steel synthesized in situ by laser surface alloying

Modeling Young's Modulus of Polymer-layered Silicate Nanocomposites Using a Modified Halpin—Tsai Micromechanical Model

article

Modeling the Etching Rate and Uniformity of Plasma-Aided Manufacturing Using Statistical Experimental Design

Multiresponse Optimization of Surface Plasma Treatment Using Taguchi Method

Near-threshold ultraviolet-laser ablation of Kapton film investigated by x-ray photoelectron spectroscopy

Optimal Design of Life Testing for High-Brightness White LEDs Using the Six Sigma DMAIC Approach

Photochemical Copper Coating on 3D Printed Thermoplastics.

scientific article

Physics-of-Failure-Based Prognostics and Health Management for High-Power White Light-Emitting Diode Lighting

article

Prognostics of Chromaticity State for Phosphor-Converted White Light Emitting Diodes Using an Unscented Kalman Filter Approach

Quality and Reliability of High Aspect-Ratio Blind Microvias Formed by Laser-Assisted Seeding Mechanism in PCB

Rapid prototyping of polymer-based MEMS devices using UV YAG laser

Return on investment associated with PHM applied to an LED lighting system

Review of life cycle assessment on consumer electronic products: Developments and the way ahead

article published in 2016

Rheological Characterization and Statistical Modeling of Resin Flow of No-flow Polyimide Prepreg in Rigid-Flex Printed Circuit Lamination

Size Effect of AlN on the Performance of Printed Circuit Board (PCB) Material-brominated Epoxy Resin

Studies on laser ablation of low temperature co‐fired ceramics (LTCC)

Study on ceramic/polymer composite fabricated by laser cutting

Surface characterization of pre-treated copper foil used for PCB lamination

The control of the thin-plate welds geometry and microstructure

The degradation of elastic properties of aluminum alloy 2024T3 due to strain damage

scholarly article by C.Y. Tang et al published December 1997 in Scripta Materialia

The effect of plasma etching process on rigid flex substrate for electronic packaging application

The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

article

The values of TQM in the revised ISO 9000 quality system

Theoretical and experimental study on the kerf profile of the laser micro-cutting NiTi shape memory alloy using 355 nm Nd:YAG

Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance

Thermal Management for Boron Nitride Filled Metal Core Printed Circuit Board

Thermal performance and placement design of LED array package on PCB

Time-variant reliability analysis of ship grillage structure

UV Nd:YAG laser ablation of copper: chemical states in both crater and halo studied by XPS

XPS investigation of Upilex-S polyimide ablated by 355 nm Nd:YAG laser irradiation

XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser

article by D.W. Zeng et al published April 2002 in Surface & Coatings Technology

XPS investigation on Upilex-S polyimide ablated by pulse TEA CO2 laser

article by D.W. Zeng & K.C. Yung published August 2001 in Applied Surface Science

Paulina is supported by:

About Paulina

Help