Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages
| Image |  |
|---|---|
| Description | article |
| Author/s |
author: Winco Kam Chuen Yung Ahmed Sharif |
| Publication date | November 2009 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |