Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads
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| Description | scholarly article by Tama Fouzder et al published February 2011 in Journal of Alloys and Compounds |
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author: Winco Kam Chuen Yung Ahmed Sharif |
| Publication date | February 2011 |
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