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List of works by Carol A. Handwerker

A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties

scientific article published on 24 August 2013

A Versatile Solution Route to Efficient Cu2ZnSn(S,Se)4Thin-Film Solar Cells

scientific article published on 12 March 2015

A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth

scientific article published in 2010

Advances in Pb-free Solder Microstructure Control and Interconnect Design

scientific article published on 9 June 2016

Alloy Selection

Comment on "Size-dependent melting properties of small tin particles: nanocalorimetric measurements"

scientific article published on 04 May 2010

Composition control of the microstructure of Ba2YCu3O6+x

scientific article published in June 1988

Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

scientific article published on 7 December 2011

Controlling growth rate anisotropy for formation of continuous ZnO thin films from seeded substrates.

scientific article

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

scientific article published in July 2010

Determination of the prior austenitic grain size of selected steels using a molten glass etch

scientific article published in March 1991

Dihedral Angles in Magnesia and Alumina: Distributions from Surface Thermal Grooves

scientific article published in May 1990

Effect of a Liquid Phase on the Morphology of Grain Growth in Alumina

scientific article published in May 1987

Effect of chemical composition on sintering of ceramics

scientific article published in May 1986

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

scientific article published on 23 January 2014

Effects of Chemical Inhomogeneities on Grain Growth and Microstructure in Al2O3

scientific article published in January 1989

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation

scientific article published on 23 January 2013

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM

scientific article published on 11 March 2013

Emerging Science and Research Opportunities for Metals and Metallic Nanostructures

scientific article published on 6 June 2014

Equilibrium geometries of anisotropic surfaces and interfaces

scientific article published in April 1993

Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

scientific article published on 22 February 2012

Evolution of tin whiskers and subsiding grains in thermal cycling

scientific article published on 11 October 2013

Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

article

Fabrication of conductive interconnects by Ag migration in Cu–Ag core-shell nanoparticles

scientific article published on 5 April 2010

Foreword

scientific article published on 28 August 2009

Foreword

scientific article published on 22 October 2008

Formation of alumina-chromia-chromium composites by a partial reduction reaction

scientific article published in June 1995

Formation of the ST12 phase in nanocrystalline Ge at ambient pressure

scientific article published in 2010

Fundamental Properties of Pb-Free Solder Alloys

scientific article published in 2007

GreenTV: A project-based learning module on sustainable electronics

scientific article published in May 2011

Growth of single crystalline seeds into polycrystalline strontium titanate: Anisotropy of the mobility, intrinsic drag effects and kinetic shape of grain boundaries

scientific article published in August 2015

Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling

scientific article published on 18 August 2016

Integrated Sustainable Life Cycle Design: A Review

scientific article published in September 2010

Intrinsic and Interdiffusion in Cu-Sn System

scientific article published on 13 May 2011

Introduction

Jet mill grinding of portland cement, limestone, and fly ash: Impact on particle size, hydration rate, and strength

scientific article published in November 2013

Kesterite Cu2ZnSn(S,Se)4 Absorbers Converted from Metastable, Wurtzite-Derived Cu2ZnSnS4 Nanoparticles

scientific article published on 20 May 2014

Maximum entropy fracture model and fatigue fracture of mixed SnPb/Sn3.0Ag0.5Cu solder alloys

scientific article published in May 2012

Maximum entropy fracture model and its use for predicting cyclic hysteresis in Sn3.8Ag0.7Cu and Sn3.0Ag0.5 solder alloys

scientific article published in November 2014

Maximum entropy fracture model and its use for predicting cyclic hysteresis in solder alloys

scientific article published in May 2012

Metal Reference Line Technique for Obtaining Dihedral Angles from Surface Thermal Grooves

scientific article published in May 1990

Metal-metal chalcogenide molecular precursors to binary, ternary, and quaternary metal chalcogenide thin films for electronic devices

scientific article published on 16 March 2016

Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause

scientific article published on 28 September 2011

Morphology of grain growth in response to diffusion induced elastic stresses: cubic systems

scientific article published in May 1993

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys

scientific article published on 8 January 2015

Nucleation kinetics of sodium disilicate

scientific article published in December 1977

Observations on crystal defects associated with diffusion induced grain boundary migration in CuZn

scientific article published in June 1986

Optimization of Cu–Ag Core–Shell Solderless Interconnect Paste Technology

scientific article published in July 2015

Overview No. 98 I—Geometric models of crystal growth

scientific article published in July 1992

Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

scientific article published in May 2013

Robert L. Coble: A Retrospective

article

Silver layer instability in a SnO2/Ag/SnO2 trilayer on silicon

scientific article published in July 2012

Solution-processed copper arsenic sulfide thin films for photovoltaic applications

scientific article published in 2017

Stability and Surface Energies of Wetted Grain Boundaries in Aluminum Oxide

scientific article published in February 1994

The Effect of Bi Contamination on the Solidification Behavior of Sn-Pb Solders

scientific article published on 9 May 2007

The equilibrium crystal shape of strontium titanate and its relationship to the grain boundary plane distribution

scientific article published in January 2015

Thermodynamics and kinetics of reactions at interfaces in composites

scientific article published in June 1990

Utilizing the thermodynamic nanoparticle size effects for low temperature Pb-free solder

scientific article published in February 2012

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

scientific article published in April 2013

Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films

scientific article published in May 2008