Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films
| Image |  |
|---|---|
| Description | scientific article published in May 2008 |
| Author/s |
author: John E. Blendell Carol A. Handwerker |
| Publication date | May 2008 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |