A study of Ag micro-particle reinforced Sn-Zn matrix composite solder

Ceramic — Ceramic joining using glass frit for high temperature application

Characteristics of Zn–Sb based high temperature solder alloy

Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni–P by the molten Sn3.5Ag0.5Cu solder alloy

Customized glass sealant for ceramic substrates for high temperature electronic application

Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow

article published in 2004

Dissolution of electroless Ni metallization by lead-free solder alloys

Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reaction with the Au/Ni metallization in microelectronic packaging

Effect of 3 wt.% Bi in Sn-Zn solder on the interfacial reactions with the Au/Ni metallization

article

Effect of 9wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

article

Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads

Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization

article

Effect of micron size Ni particle addition in Sn–8Zn–3Bi lead-free solder alloy on the microstructure, thermal and mechanical properties

article

Effect of multiple reflows on mechanical strength of the interface formed between Sn–Zn–Bi solder and Au/Ni/Cu bond pad

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn–9Zn solder on Au/Ni metallized Cu pads

article

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

article

Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

article

Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

article

Effect of substrate metallization on interfacial reactions and reliability of Sn–Zn–Bi solder joints

Effect of volume in interfacial reaction between eutectic Sn–Pb solder and Cu metallization in microelectronic packaging

article published in 2004

Electronic packages for high pressure applications: A dome-shaped cavity design

Influence of Ag micro-particle additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

article

Influence of SrTiO3 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads

scholarly article by Tama Fouzder et al published February 2011 in Journal of Alloys and Compounds

Influence of small amount of Al and Cu on the microstructure, microhardness and tensile properties of Sn–9Zn binary eutectic solder alloy

article published in 2009

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Interfacial reactions of BGA Sn–3.5%Ag–0.5%Cu and Sn–3.5%Ag solders during high-temperature aging with Ni/Au metallization

Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

Interfacial reactions of Sn–Cu and Sn–Pb–Ag solder with Au/Ni during extended time reflow in ball grid array packages

article

Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn–In–Ag–Cu solder

Investigation of interfacial reactions between Sn–Zn solder with electrolytic Ni and electroless Ni(P) metallization

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

article

Liquid and solid state interfacial reactions of Sn–Ag–Cu and Sn–In–Ag–Cu solders with Ni–P under bump metallization

Pb-Free Glass Paste: A Metallization-Free Die-Attachment Solution for High-Temperature Application on Ceramic Substrates

article published in 2013

Retardation of spalling by the addition of Ag in Sn–Zn–Bi solder with the Au/Ni metallization

article

Review on advances in nanoscale microscopy in cement research

scientific article published on 25 September 2015

Structural transition and its effect in La, Zr co-substituted mono-domain BiFeO3

article published in 2016

Structural, dielectric and magnetic properties of Ta-substituted Bi0.8La0.2FeO3 multiferroics

article published in 2015

Study of thin film metallization adhesion in ceramic multichip module

Study on the properties of Zn–xNi high temperature solder alloys

Study on wear properties of aluminium–silicon piston alloy

Synthesis and characterization of indium doped cadmium sulfide nanoribbons

article

The effect of curing on the performance of ACF bonded chip‐on‐flex assemblies after thermal ageing

article published in 2005

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

article

Transient liquid phase Ag-based solder technology for high-temperature packaging applications

Utilization of open pit burned household waste ash--a feasibility study in Dhaka

scientific article published on 19 March 2014

ZnSxSe1−x nanowire arrays with tunable optical properties grown on ZnS nanoribbon substrates