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List of works by Wyatt Jason Moy

Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module

Research Paper published in the Journal of Electronic Packaging - 06/07/2023

Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform

Research Paper published in the Journal of Electronic Packaging - 9/30/2023

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