Search filters

List of works by John E. Blendell

A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties

scientific article published on 24 August 2013

A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth

scientific article published in 2010

Composition control of the microstructure of Ba2YCu3O6+x

scientific article published in June 1988

Decoupling of superposed textures in an electrically biased piezoceramic with a 100 preferred orientation

article

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

scientific article published in July 2010

Effect of Crystallographic Orientation on Subcritical Grain Boundary Cracking in a Conventionally Cast Polycrystalline Nickel-Based Superalloy

scientific article published on May 30, 2013

Effect of Texture on Temperature-Dependent Properties of K0.5Na0.5NbO3Modified Bi1/2Na1/2TiO3-xBaTiO3

Effect of chemical composition on sintering of ceramics

scientific article published in May 1986

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

scientific article published on 23 January 2014

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation

scientific article published on 23 January 2013

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation – CORRIGENDUM

scientific article published on 11 March 2013

Evolution of tin whiskers and subsiding grains in thermal cycling

scientific article published on 11 October 2013

Growth of single crystalline seeds into polycrystalline strontium titanate: Anisotropy of the mobility, intrinsic drag effects and kinetic shape of grain boundaries

scientific article published in August 2015

Heterogeneous Stress Relaxation Processes at Grain Boundaries in High-Sn Solder Films: Effects of Sn Anisotropy and Grain Geometry During Thermal Cycling

scientific article published on 18 August 2016

Note: Thermal analog to atomic force microscopy force-displacement measurements for nanoscale interfacial contact resistance

scientific article published on 01 March 2010

Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

scientific article published in May 2013

Stability and Surface Energies of Wetted Grain Boundaries in Aluminum Oxide

scientific article published in February 1994

The Importance of Distributed Loading and Cantilever Angle in Piezo-Force Microscopy

article

The equilibrium crystal shape of strontium titanate and its relationship to the grain boundary plane distribution

scientific article published in January 2015

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

scientific article published in April 2013

Whiskers, hillocks, and film stress evolution in electroplated Sn and Sn-Cu films

scientific article published in May 2008