Enhancement of interface thermal conductance between Cr-Ni alloy and dielectric via Cu nano-interlayer
| Image |  |
|---|---|
| Description | scientific article published on 25 June 2020 |
| Author/s |
author: Dengke Ma |
| Publication date | June 25, 2020 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |