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Characteristics of an Amorphous Carbon Layer as a Diffusion Barrier for an Advanced Copper Interconnect

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Description scientific article published on 31 December 2019
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author: Cheol-Woong Yang  Jin-Su Oh  Byeong-Seon An  Changmin Lee  Hyoungsub Kim  Yena Kwon 

Publication date December 31, 2019
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