3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage
| Image |  |
|---|---|
| Description | scientific article published on 28 October 2019 |
| Author/s |
author: Phillip Lee Min Jae Ko Hae Jung Son |
| Publication date | October 28, 2019 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |