An adhesive bonding approach by hydrogen silsesquioxane for silicon carbide-based LED applications
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| Description | scholarly article by Li Lin et al published March 2019 in Materials Science in Semiconductor Processing |
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author: Yiyu Ou Peter Wellmann Valdas Jokubavicius Haiyan Ou Berit Herstrøm Mikael Syväjärvi Flemming Jensen |
| Publication date | March 2019 |
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