High-Aspect-Ratio Through Silicon Vias for High-Frequency Application Fabricated by Magnetic Assembly of Gold-Coated Nickel Wires
| Image |  |
|---|---|
| Description | scholarly article by Simon J. Bleiker et al published January 2015 in IEEE transactions on components, packaging, and manufacturing technology |
| Author/s | |
| Publication date | January 2015 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |