Study of low temperature MOCVD deposition of TiN barrier layer for copper diffusion in high aspect ratio through silicon vias
| Image |  |
|---|---|
| Description | |
| Author/s |
author: Daniel Mathiot Fabien Piallat |
| Publication date | May 2014 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |