Effects of abrasive particle size and molecular weight of poly(acrylic acid) in ceria slurry on removal selectivity of SiO2/Si3N4 films in shallow trench isolation chemical mechanical planarization
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| Description | article by Hyun-Goo Kang et al published March 2007 in Journal of Materials Research |
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author: Paik Un-gyu |
| Publication date | March 2007 |
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