Thermal Stress Assessment for Transient Liquid-Phase Bonded Si Chips in High-Power Modules Using Experimental and Numerical Methods
| Image |  |
|---|---|
| Description | |
| Author/s |
author: Christian Leinenbach |
| Publication date | November 2, 2016 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |