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Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process

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Description scientific article published on 11 April 2018
Author/s

author: Hyeong Min Jin  Nuri Oh  Yihui Zhang  Zhaoqian Xie  Xueju Wang  Hokyung Jang  John A. Rogers  Jan-Kai Chang  Yonggang Huang  Bong Hoon Kim 

Publication date April 11, 2018
Language English
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