CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems
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| Description | scientific article published in 2022 |
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author: Martin Rapp Jorg Henkel Lokesh Siddhu Rajesh Kedia Anuj Pathania Preeti Ranjan Panda Shailja Pandey |
| Publication date | August 22, 2022 |
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