Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module
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| Description | Research Paper published in the Journal of Electronic Packaging - 06/07/2023 |
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author: Alan Mantooth Yujui Lin Tiwei Wei Wyatt Jason Moy Man Prakash Gupta Michael Degner Mehdi Asheghi Hao Chen Kenneth Goodson |
| Publication date | June 7, 2023 |
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