Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
| Image |  |
|---|---|
| Description | Research Paper published in the Journal of Electronic Packaging - 9/30/2023 |
| Author/s | |
| Publication date | September 30, 2023 |
| Language | |
| Country of origin | |
| Wikipedia link | |
| Copyright status | |
| Missing/wrong data? | Edit Wikidata item |