Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
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| Description | Research Paper published in the Journal of Electronic Packaging - 9/30/2023 |
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author: Alan Mantooth Yujui Lin Tiwei Wei Wyatt Jason Moy Man Prakash Gupta Michael Degner Mehdi Asheghi Kenneth Goodson Hao Chen |
| Publication date | September 30, 2023 |
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